{{brizy_dc_image_alt imageSrc=
Join/ Subscribe Us

Subscribe

We recognize the significance of content in the modern digital world. Sign up on our website to receive the most recent technology trends directly in your email inbox..





    We assure a spam-free experience. You can update your email preference or unsubscribe at any time and we'll never share your information without your consent. Click here for Privacy Policy.


    Safe and Secure

    Free Articles

    {{brizy_dc_image_alt imageSrc=
    Join/ Subscribe Us

    Subscribe

    We recognize the significance of content in the modern digital world. Sign up on our website to receive the most recent technology trends directly in your email inbox.





      We assure a spam-free experience. You can update your email preference or unsubscribe at any time and we'll never share your information without your consent. Click here for Privacy Policy.


      Safe and Secure

      Free Articles

      Semiconductor

      KnowledgeNile is the one of the emerging technology content marketing organizations. 

      {{brizy_dc_image_alt entityId=
      Canada invests in the semiconductor sector in partnership with IBM Canada and C2MI
      The project will increase advanced packaging and commercialization capabilities BROMONT, QC, Nov. 28, 2025 /CNW/ - Today, Carlos Leitão, Parliamentary Secretary to the Minister of Industry and Member of Parliament for Marc-Aurèle-Fortin on behalf of the Honourable Mélanie Joly, Minister of Industry and Minister responsible for Canada Economic Development for Quebec Regions, announced a new federal […]
      {{brizy_dc_image_alt entityId=
      AI and Photonics: Leading a New Era with Dr. Suresh Venkatesan, Chairman and CEO of POET Technologies
      In this episode, we are excited to host Dr. Suresh Venkatesan, the Chairman and CEO of POET Technologies, a frontrunner in designing and developing high-speed photonics products engineered specifically for the artificial intelligence systems market and hyper-scale data centers.
      {{brizy_dc_image_alt entityId=
      IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights
      BOSTON, Jan. 10, 2024 /-- Semiconductor packaging technologies have evolved from initial 1D PCB levels to cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency. Four critical parameters shape advanced semiconductor packaging: power, performance, area, and cost: Power: Enhancing […]


      Scroll to Top